Stm32f411 Ceu6, Placa De Desarrollo 128kb Ram, 512kb Rom

Descripción

The STM32F411xC/xE devices are based on the high-performance Arm Cortex -M4 32-bit RISC core operating at a frequency of up to 100 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32F411xC/xE belongs to the STM32 Dynamic Efficiency product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.
The STM32F411xC/xE incorporate high-speed embedded memories (up to 512 Kbytes of Flash memory, 128 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB bus and a 32-bit multi-AHB bus matrix.
All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.
The STM32F411xC/xE operate in the - 40 to + 125 C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.
These features make the STM32F411xC/xE microcontrollers suitable for a wide range of applications.

Key Features
Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
o 1.7 V to 3.6 V power supply
o - 40 C to 85/105/125 C temperature range
* Core: Arm 32-bit Cortex-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
* Memories
o Up to 512 Kbytes of Flash memory
o 128 Kbytes of SRAM
* Clock, reset and supply management
o 1.7 V to 3.6 V application supply and I/Os
o POR, PDR, PVD and BOR
o 4-to-26 MHz crystal oscillator
o Internal 16 MHz factory-trimmed RC
o 32 kHz oscillator for RTC with calibration
o Internal 32 kHz RC with calibration
* Power consumption
o Run: 100 uA/MHz (peripheral off)
o Stop (Flash in Stop mode, fast wakeup time): 42 uA Typ @ 25C; 65 uA max @25 C
o Stop (Flash in Deep power down mode, slow wakeup time): down to 9 uA @ 25 C; 28 uA max @25 C
o Standby: 1.8 uA @25 C / 1.7 V without RTC; 11 uA @85 C @1.7 V
o VBAT supply for RTC: 1 uA @25 C


* 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
* General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
* Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer

* Debug mode
o Serial wire debug (SWD) & JTAG interfaces
o Cortex-M4 Embedded Trace Macrocell

* Up to 81 I/O ports with interrupt capability
o Up to 78 fast I/Os up to 100 MHz
o Up to 77 5 V-tolerant I/Os

* Up to 13 communication interfaces
o Up to 3 x I2C interfaces (SMBus/PMBus)
o Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
o Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), SPI2 and SPI3 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock
o SDIO interface (SD/MMC/eMMC)
o Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY

* CRC calculation unit
* 96-bit unique ID
* RTC: subsecond accuracy, hardware calendar
* All packages (WLCSP49, LQFP64/100, UFQFPN48, UFBGA100) are ECOPACK2